Particle and Kigen Collaborate to Streamline and Expand IoT eSIM Solutions

SeniorTechInfo
2 Min Read

The Challenges of Scaling IoT Connectivity

As IoT adoption continues to rise, developers face challenges in managing cellular connectivity at scale. Traditional SIM cards and complex eSIM standards have hindered interoperability and scalability across diverse environments.

Enter GSMA SGP.32 – a game-changer in simplifying IoT management with eIM and IoT Profile Assistant. These advancements align perfectly with Particle’s goal of creating a seamless and secure IoT experience.

Kigen’s Leading Role in Simplifying IoT at Scale

Kigen has been instrumental in shaping GSMA specifications like SGP.32, which focuses on streamlining eSIM implementations for IoT devices. Their technology allows developers to manage devices remotely, perform updates seamlessly, and optimize connectivity without physical SIM cards.

Particle’s Adoption of Kigen Technology

Particle’s adoption of Kigen’s eSIM SGP.22 solution signifies a significant advancement in the IoT landscape, ensuring compatibility with global standards. Features like Fleet Management via eIM and In-Factory Provisioning streamline the deployment process for IoT devices.

Expanding into Non-Terrestrial Networks (NTN)

Collaborating with Kigen opens new possibilities for Particle in Non-Terrestrial Networks (NTN), including satellite-based connectivity. This integration allows for seamless connectivity switches in remote or challenging environments.

A Shared Vision for the Future of IoT

Particle and Kigen share a commitment to simplifying IoT development and empowering developers with scalable and secure solutions. This partnership paves the way for the next generation of IoT innovations, removing barriers to connectivity and fostering growth in the industry.

Learn more about this groundbreaking partnership at Particle’s booth at Embedded World North America from October 8th to 10th.

Share This Article
Leave a comment

Leave a Reply

Your email address will not be published. Required fields are marked *